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Lead the design and development of high-speed analog ICs, manage chip subsystems, innovate circuit designs, mentor junior engineers, and communicate technical concepts effectively.

Responsible for end-to-end layout of high-speed ICs, leading the layout team, collaborating with design engineers, and ensuring manufacturable designs meet objectives.

Design and deliver analogue and mixed-signal blocks (TIAs, laser drivers) for high-speed ICs up to 200G. Collaborate with layout, verification, test, and product teams to meet performance, power, area, and reliability targets through simulation, lab validation, and design reviews.

Lead and manage a multidisciplinary analog/mixed-signal IC design team, own end-to-end NPI from concept to production, drive design execution and risk management across concurrent high-speed programmes, coordinate cross-functional stakeholders, lead pre-tape-out reviews, and oversee post-silicon bring-up and performance optimisation.

The Principal Analog Design Engineer leads high-speed analog IC design, manages chip development projects, drives innovation, and mentors junior engineers while collaborating with cross-functional teams.