Lead mechanical, thermal, magnetic shielding, packaging, and alignment design for chip-scale atomic clocks, magnetometers, and gyroscopes. Own products from concept through prototypes, testing, drawings, production release, and volume manufacturing. Build thermal and structural models, design vacuum and hermetic packages, conduct vibration and environmental testing, develop fixtures and tooling, establish design standards, and collaborate with physics, photonics, electronics, manufacturing, and UK suppliers.

Lead the development of a chip-scale quantum vapor-sensing platform from system architecture through prototype and product development. Responsibilities include technical direction, subsystem integration, testing, characterization, calibration, risk management, documentation, team leadership, partner engagement, and recruiting. The role requires hands-on expertise in quantum sensing or related precision systems, systems engineering, data acquisition, test scripting, and experimental automation.

Owns board-level analog and RF hardware for chip-scale atomic clocks, from circuit design and PCB layout through bring-up, characterization, and production. Responsibilities include precision analog front ends, microwave synthesis, VCSEL drive, thermal control, noise budgeting, test automation, firmware interfaces, manufacturability, design standards, reviews, and mentoring. The role is hands-on and based full-time onsite in London.