Lead mechanical simulation and reliability engineering for telecom hardware. Develop advanced nonlinear structural and thermo-mechanical FEM models covering shock, vibration, drop, thermal cycling, solder-joint fatigue, package warpage, and TIM behavior. Correlate simulations with testing and field returns, guide root-cause analysis, define design rules and requirements, and drive packaging technology roadmaps. Mentor engineers and influence cross-functional hardware, PCB, thermal, verification, and sourcing decisions.
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About this opportunity
At Ericsson, we build the hardware behind the world's mobile networks - where mechanical reliability determines how products perform and survive years of temperature swings, power cycling, transport and demanding field environments.
We are now looking for a Master Developer in Mechanical Simulation & Reliability to become the technical anchor for structural and thermo-mechanical integrity across our radio and baseband hardware, within our Mechanical & Thermal Solutions department.
You will own and evolve our mechanical simulation and physics-of-failure methodology, be the person the organization turns to on its hardest reliability questions, and influence hardware design from early concept through verification and field-return root-cause analysis. You will work closely with thermal design, system, PCB/layout, verification and sourcing - influencing decisions early, where simulation has the greatest impact.
What you will do• Lead advanced mechanical FEM and structural reliability assessments covering drop, shock, vibration, board-level dynamic response, and package/PCB deformation.• Develop and apply advanced nonlinear thermo-mechanical FEM methodologies to predict solder-joint fatigue, package warpage, and long-term reliability under thermal and power cycling conditions.• Develop mechanical simulation models to understand how product assembly processes, clamping, and thermal interface material (TIM) behavior induce stresses in component packages and solder joints.• Correlate simulation results with physical testing, measurement data, and field returns to build trustworthy and defensible models, and support root-cause analysis of field and factory issues.• Translate simulation insight into early design decisions, product requirements, design rules, and acceptance criteria.• Own and continuously evolve the mechanical reliability simulation methodology, introducing new methods, models, and tools that strengthen the capability of the wider team.• Drive the packaging technology area, including its technology roadmap, early technology development, and pre-development activities.• Guide and mentor engineers, and represent mechanical reliability in discussions with designers, projects, technical leaders, and senior stakeholders.
The skills you bring
We are looking for a recognized expert in mechanical simulation with a strong understanding of reliability physics - someone who enjoys solving difficult engineering problems and turning simulation into practical design guidance.
Essential experience:• Deep, demonstrated expertise in nonlinear structural and thermo-mechanical FEM. Depth of expertise and a strong track record matter more than years of experience alone.• Strong proficiency in a leading FEM platform such as Ansys Mechanical, including advanced nonlinear, viscoplastic and creep material modelling.• Strong understanding of reliability physics, including solder-joint fatigue, creep, damage mechanisms, acceleration factors and lifetime prediction.• Experience in solder-joint, package and TIM modelling, including correlation of simulation results with measurements and physical testing.• Ability to translate simulation insight into design decisions, design rules, product requirements and acceptance criteria.• Working knowledge of relevant standards such as IPC-9701/9704, JEDEC/JESD22, Telcordia GR-63 (NEBS) and applicable IEC standards.• Good understanding of electronics hardware, packaging and PCB assemblies, with the ability to collaborate closely with thermal, system, PCB/layout and mechanical design disciplines.• Strong communication skills, with the ability to lead technical discussions, mentor others and influence decisions across teams and disciplines.
It is a plus if you have experience with• Physics-of-failure and reliability tools such as Ansys Sherlock.• TIM characterization, material modelling and measurement methods.• Package warpage characterization, pad cratering, BGA corner-joint failure and other package/interconnect failure mechanisms.• Board-level drop and shock simulation and correlation, as well as PCB fabrication, SMT assembly and reflow processes.• Design of Experiments (DoE), surrogate or reduced-order models, digital twins, or AI/ML approaches for accelerating simulation and engineering analysis.• Telecom/RAN or other long-life electronics hardware designed for demanding environments.
Who you are
You are curious about why hardware fails and motivated by turning simulation insight into designs that last.
You are a natural technical leader who can make complex simulation understandable, challenge assumptions constructively and influence design decisions across disciplines.
You also enjoy sharing your knowledge and helping others grow, and colleagues naturally turn to you when facing challenging reliability or mechanical design problems.
Why join us?
This is an opportunity to take a leading technical role in mechanical reliability for advanced telecom hardware, and to influence both the products we develop today and the technologies we will use tomorrow.
You will have the opportunity to:• Drive the packaging technology area and take a leading technical role in solder-joint reliability and robustness simulation.• Influence design decisions early and help define the requirements and design rules that follow.• Work closely with skilled experts across thermal, system, PCB, verification and other engineering disciplines.• Develop new simulation methods and explore how automation and AI-assisted engineering can improve the way we work.
Join us and help build networks the world can depend on.
Why join Ericsson?
At Ericsson, you'll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what's possible. To build solutions never seen before to some of the world's toughest problems. You'll be challenged, but you won't be alone. You'll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.
What happens once you apply?
Click Here to find all you need to know about what our typical hiring process looks like.Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer. learn more.
Primary country and city: Sweden (SE) || Stockholm
Req ID: 790751
About this opportunity
At Ericsson, we build the hardware behind the world's mobile networks - where mechanical reliability determines how products perform and survive years of temperature swings, power cycling, transport and demanding field environments.
We are now looking for a Master Developer in Mechanical Simulation & Reliability to become the technical anchor for structural and thermo-mechanical integrity across our radio and baseband hardware, within our Mechanical & Thermal Solutions department.
You will own and evolve our mechanical simulation and physics-of-failure methodology, be the person the organization turns to on its hardest reliability questions, and influence hardware design from early concept through verification and field-return root-cause analysis. You will work closely with thermal design, system, PCB/layout, verification and sourcing - influencing decisions early, where simulation has the greatest impact.
What you will do• Lead advanced mechanical FEM and structural reliability assessments covering drop, shock, vibration, board-level dynamic response, and package/PCB deformation.• Develop and apply advanced nonlinear thermo-mechanical FEM methodologies to predict solder-joint fatigue, package warpage, and long-term reliability under thermal and power cycling conditions.• Develop mechanical simulation models to understand how product assembly processes, clamping, and thermal interface material (TIM) behavior induce stresses in component packages and solder joints.• Correlate simulation results with physical testing, measurement data, and field returns to build trustworthy and defensible models, and support root-cause analysis of field and factory issues.• Translate simulation insight into early design decisions, product requirements, design rules, and acceptance criteria.• Own and continuously evolve the mechanical reliability simulation methodology, introducing new methods, models, and tools that strengthen the capability of the wider team.• Drive the packaging technology area, including its technology roadmap, early technology development, and pre-development activities.• Guide and mentor engineers, and represent mechanical reliability in discussions with designers, projects, technical leaders, and senior stakeholders.
The skills you bring
We are looking for a recognized expert in mechanical simulation with a strong understanding of reliability physics - someone who enjoys solving difficult engineering problems and turning simulation into practical design guidance.
Essential experience:• Deep, demonstrated expertise in nonlinear structural and thermo-mechanical FEM. Depth of expertise and a strong track record matter more than years of experience alone.• Strong proficiency in a leading FEM platform such as Ansys Mechanical, including advanced nonlinear, viscoplastic and creep material modelling.• Strong understanding of reliability physics, including solder-joint fatigue, creep, damage mechanisms, acceleration factors and lifetime prediction.• Experience in solder-joint, package and TIM modelling, including correlation of simulation results with measurements and physical testing.• Ability to translate simulation insight into design decisions, design rules, product requirements and acceptance criteria.• Working knowledge of relevant standards such as IPC-9701/9704, JEDEC/JESD22, Telcordia GR-63 (NEBS) and applicable IEC standards.• Good understanding of electronics hardware, packaging and PCB assemblies, with the ability to collaborate closely with thermal, system, PCB/layout and mechanical design disciplines.• Strong communication skills, with the ability to lead technical discussions, mentor others and influence decisions across teams and disciplines.
It is a plus if you have experience with• Physics-of-failure and reliability tools such as Ansys Sherlock.• TIM characterization, material modelling and measurement methods.• Package warpage characterization, pad cratering, BGA corner-joint failure and other package/interconnect failure mechanisms.• Board-level drop and shock simulation and correlation, as well as PCB fabrication, SMT assembly and reflow processes.• Design of Experiments (DoE), surrogate or reduced-order models, digital twins, or AI/ML approaches for accelerating simulation and engineering analysis.• Telecom/RAN or other long-life electronics hardware designed for demanding environments.
Who you are
You are curious about why hardware fails and motivated by turning simulation insight into designs that last.
You are a natural technical leader who can make complex simulation understandable, challenge assumptions constructively and influence design decisions across disciplines.
You also enjoy sharing your knowledge and helping others grow, and colleagues naturally turn to you when facing challenging reliability or mechanical design problems.
Why join us?
This is an opportunity to take a leading technical role in mechanical reliability for advanced telecom hardware, and to influence both the products we develop today and the technologies we will use tomorrow.
You will have the opportunity to:• Drive the packaging technology area and take a leading technical role in solder-joint reliability and robustness simulation.• Influence design decisions early and help define the requirements and design rules that follow.• Work closely with skilled experts across thermal, system, PCB, verification and other engineering disciplines.• Develop new simulation methods and explore how automation and AI-assisted engineering can improve the way we work.
Join us and help build networks the world can depend on.
Why join Ericsson?
At Ericsson, you'll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what's possible. To build solutions never seen before to some of the world's toughest problems. You'll be challenged, but you won't be alone. You'll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.
What happens once you apply?
Click Here to find all you need to know about what our typical hiring process looks like.Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer. learn more.
Primary country and city: Sweden (SE) || Stockholm
Req ID: 790751
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