At Bose Corporation, we believe sound is the most powerful force on earth — and for over 60 years, we have been a company built on innovation, excellence, and independence. Privately owned, fiercely customer-focused, and driven by our values, we continue to lead industries and transform lives through sound.
Today, Bose Corporation is entering an exciting new era. Across multiple global Business Units and Global Functions, we are shaping the future of audio technology, automotive, luxury, and premium experiences. We invite you to join us in this transformation.
Job DescriptionBose Corporation is seeking a PCBA Process Development Engineer located in Shenzhen. PCBA Process Development Engineer will work as part of a design/development team providing electronics manufacturing knowledge and driving the design to ensure highly manufacturable new products; reviewing, overseeing the process development of our new products; working closely with our contract manufacturers to ensure that processes are developed, documented and capable of meeting the Bose internal quality, cost and attainment requirements. This is a global role with interfaces in China, SouthEast Asia, as well as with our North America team.
Responsibilities
- Engage in early design review activity to influence printed circuit board (PCB) layout and design for manufactruing (DFM) compliance
- Represent electronics manufacturing as part of new product development team.
- Develop set based design evalations to test design/ process options to optimize designs and processes.
- Assess critical design & component attributes for use in PCB assembly process development
- Drive manufacturing deliverables - documentation, quality and cycle time goals, product cost, etc.
- Support prototype manufacturing processes, with emphasis on early risk identification & resolution
- Data collection and anlysis of proto build results to drive process and design improvements
- Specify, order and support capital equipment purchases
- Support failure analysis
Skills
- Prior experience in electronics manufacturing, surface mount technology (SMT) & thru-hole technology
- Knowledge of standard process equipment: screen printing, solder paste inspection, component placement, reflow soldering, automated optical inspection, PCBA depaneling
- Experience in tooling design & development as well as capital equipment specifications.
- Must be able to work collaboratively with local and remote design and manufacturing teams.
- Must have strong written and verbal communication skills in mandarin and english
- Training in structured problem solving tools: 5-Why, 8-D
- Ability to develop and utilize APQP tools: PFMEA, Control Plan, CpK & GR&R
- Working knowledge of industry standards: IPC-A-610, J-STD-001
- Experience with various materials & chemistries: PCB surface finishes, solder pastes, fluxes, conformal coatings, bonding & underfill materials
- Travelmay be required
Education Requirements
- Bachelor of Science in Engineering
Professional Work Experience Requirements
- 5 - 7 years working in electronics manufacturing with responsibility for PCB assembly
- Experience working with contract manufacurers is a plus.
- DOE capability in new technologies or new provess is preferred.
Our goal is to create an atmosphere where every candidate feels supported and empowered in the interviewing process. Diversity and inclusion are integral to our success, and we believe that providing reasonable accommodation is not only a legal obligation but also a fundamental aspect of our commitment to being an employer of choice. We recognize that individuals may have different needs and requirements based on their abilities, and we provide reasonable accommodations to ensure ideal conditions are met during the application process.
