AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, optics and interconnect enables a step change in system level performance.
We are seeking an experienced and highly motivated Mechanical Engineer to design and develop the mechanical systems at the heart of our next-generation compute platforms, from concept and architecture through prototype builds, qualification, and production release.
You will work on high-performance, thermally demanding hardware: chassis, cooling integration, rack-scale infrastructure, and complex electromechanical assemblies and collaborating closely across Electronics, Optical, Systems, Software, Manufacturing, and Quality teams.
The ideal candidate owns mechanical architecture end to end, balances thermal, structural, and manufacturability trade-offs with confidence, and thrives building breakthrough infrastructure in a fast-moving environment.
ResponsibilitiesOwn the mechanical architecture of assigned products and subsystems including: chassis, enclosures, structural assemblies, cooling systems, and rack-integrated hardware. Driving these products from concept through validation, production release, and lifecycle support
Design solutions that balance thermal performance, mechanical robustness, serviceability, manufacturability, scalability, and cost
Create detailed CAD models, engineering drawings, bills of materials, and technical documentation, applying GD&T and DFM/DFA/DFR/DFS principles throughout
Drive thermal management strategies including airflow optimisation, liquid cooling integration, cold plates, and system-level heat rejection
Define mechanical interfaces between compute, networking, power, optical, and cooling subsystems, and contribute to rack-level integration (structural design, service access, cable and airflow management)
Conduct and interpret mechanical, thermal, airflow, and structural analysis (FEA/CFD) to support design decisions
Support product development from prototype builds and EVT/DVT/PVT through qualification testing and production release
Lead root cause analysis and corrective actions for mechanical, thermal, manufacturing, and integration issues
Work with suppliers and contract manufacturers on component qualification, tooling, manufacturability, and cost optimisation
Collaborate across multidisciplinary engineering teams and lead design reviews and system architecture discussions
Degree in Mechanical Engineering or a related discipline, with strong experience developing complex electromechanical products from concept through production
Demonstrated ownership of mechanical systems, chassis, or infrastructure across the full product lifecycle
Experience designing products incorporating dense electronics, optical subsystems, networking, or compute hardware with demanding thermal and power-density requirements
Strong grasp of mechanical design principles: structural design, materials selection, tolerancing, and manufacturability
Solid understanding of thermal management such as forced-air and liquid cooling, cold plates, thermal interface materials, and airflow optimisation
Strong 3D CAD experience (Creo, SolidWorks, NX, or equivalent) with sound knowledge of GD&T and ASME Y14.5
Experience with simulation tools for structural, thermal, vibration, and airflow analysis (FEA/CFD) and correlating models with test data
Familiarity with manufacturing processes including sheet metal, CNC, casting, moulding, extrusion, and additive
Experience across NPI, prototype qualification, and production ramp, working directly with suppliers and contract manufacturers
Clear communicator who collaborates effectively across disciplines and delivers in a fast-moving environment
Experience developing rack-scale or data centre hardware platforms
Hands-on liquid cooling integration at scale (cold plates, manifolds, CDUs)
Familiarity with AI/ML compute infrastructure and high-density accelerator systems
Experience integrating photonic or optical subsystems
Exposure to configuration management and PLM tools
Competitive Salary: Commensurate with your experience, skills, and location
Equity & Ownership: Meaningful stock options. You’re not just joining the mission; you’re owning a piece of it
Proximity Bonus: We value your time. To minimise your commute and maximise your life, we offer an annual Living-Local Bonus if your residence is within 20 minutes of the office
Retirement Benefits: Employer-contributed retirement plans to help you build long-term financial security.
