Company Overview
Ambiq is on a mission to enable intelligence everywhere — powering the AI edge revolution with the world's lowest-power semiconductor solutions.
Built on our proprietary sub- and near-threshold technology, our chips deliver multi-fold improvements in energy efficiency without costly process scaling. Since 2010, we've shipped over 300 million units to customers building smarter wearables, medical devices, IoT products, and AI-powered edge applications.
Our cross-functional teams span design, research, development, production, marketing, sales, and operations across Austin, Hsinchu, Shanghai, Shenzhen, and Singapore. We move fast, tackle hard problems, and create space for people to grow through complex, meaningful work that shapes the future of technology.
We're looking for self-motivated, creative problem-solvers who are eager to push technological limits and make a real impact in energy efficiency.
At Ambiq, we live by five values: Innovate. Collaborate. Focus. Learn. Achieve.
If that's you, join us — the intelligence everywhere revolution starts here.
Scope
We are seeking an experienced Memory Lead Engineer with expertise in memory technologies including SRAM, DRAM, HBM, RRAM, and MRAM. Energy Efficient memory has become vital for Ambiq’s products, particularly as edge AI workloads grow in complexity. As a Memory Lead Engineer, you will be responsible for end-to-end memory deployments into our products, such as defining the memory roadmap, memory evaluation, recommending memory architectures and circuit design strategies, leading memory characterization, and more. Your role will involve working closely with cross-functional teams, including system architects, circuit designers, and process engineers within Ambiq, as well as third-party memory vendors and foundries.
Responsibilities
- Research and analyze the latest memory technologies to understand their characteristics, advantages, and its limitations to provide energy efficient memory solution
- Collaborate with system architects and product teams to define memory requirements and specifications for next-generation products.
- Evaluate and simulate memory circuits and develop memory architecture and customization proposals.
- Serve as lead using both internal and third-party resources to implement new memory architectures and customizations.
- Lead memory characterization and compiler efforts.
- Conduct detailed circuit and system-level simulations to evaluate memory performance, stability, and reliability.
- Work closely with process engineers and third-party foundry engineers to ensure high yield and reliability for new memories.
- Conduct thorough analysis of memory test data, identify issues, and propose design enhancements or process modifications.
- Stay up to date with the latest advancements and industry trends in emerging memory technologies and contribute to technical discussions and brainstorming sessions.
Qualifications
- Bachelor’s degree in electronics engineering or a related field. A master's or Ph.D. degree is preferred.
- Experience in memory architecture design and memory compilers, particularly in HBM, SRAM, DRAM, MRAM, and RRAM. Proficiency in low power and high-performance memory technologies.
- Strong understanding of memory architectures, including memory cells, sense amplifiers, drivers, and peripheral circuits.
- Proficiency in industry-standard EDA tools for circuit simulation and design.
- Experience running memory characterization using standard EDA tools.
- Knowledge of layout design principles and experience working closely with layout designers.
- Familiarity with semiconductor manufacturing processes and integration challenges.
- Ability to conduct detailed analysis and troubleshooting of memory test data.
- Excellent problem-solving skills and the ability to work in a fast-paced, collaborative environment.
- Strong communication and teamwork skills to collaborate with cross-functional teams.
- Demonstrated ability to adapt to changing project priorities and meet tight deadlines.
